锡镀

Sn Plating

锡镀
product description

Advantages
1.Curved wheel blades can avoid scratching the board surface and causing indentation.
2. Using multi section free rollers to reduce pressure on silicon wafers and reduce fragmentation rate.
3.The equipment components have good universality, are easy to replace and repair, have low cost, and short cycle.

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CONTACT INFORMATION

Company Headquarters Address:

Building 2, Phase III , Wuzhong  Fumin Industrial Zone , 

Suzhou , Jiangsu

Company Branch address:

No .98-12 Lianyi Road , Luzhi Town , Suzhou , Jiangsu

手机导航显示--勿删勿改

手机导航显示--勿删勿改

Time of issue:2022-04-15 11:14:24

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