Batch-type Alkaline Polishing Equipment
product description
Equipment Application
1.This equipment is used for polishing, etching and cleaning treatment of diffused wafers and also compatible for texturing and cleaning treatment of bifacial solar cells.
2.Compatible with rear side etch polishing and mono-crystalline rear side texturing process.
3.Wafer thickness handling capability up to 110μm.
4.With dry clean area and self-cleaning system.
5.Quick inline bath change.
6.Internal circulation and bubbling, Liquid level and Temperature protection function.
7.Suitable with MES, RFID system, inline weight testing optional
CONTACT INFORMATION
手机导航显示--勿删勿改
手机导航显示--勿删勿改
Time of issue:2022-04-15 11:14:24
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