Electroplating testing machine
1. Electroplating or electroless plating of copper/tin/nickel/silver is carried out in the open area through electrochemical reactions.
2. Diversified fixture/contact solution design suitable for different wafer sizes and metallization patterns.
3. The flexible plating tank design of the laboratory equipment can meet the rapid verification requirements of chemicals. 4. Special control modes (including automation and step-by-step confirmation functions) enhance the convenience and efficiency of testing and process validation.
5. Process route
5.1 copper plating + + + cleaning drying 5.2 electroless nickel plating nickel plating + copper plating + clean + drying 5.3 + electroless copper plating tin + + cleaning drying 5.4 + copper plating nickel plating + + cleaning drying 5.5 + electroless copper plating silver + + dry cleaning
5.6 Nickel plating + electroless silver plating + cleaning + drying
| Function | Performance indicators |
| Size | 3000*2200*1200 (Adjust the size according to different processes |
| Silicon wafer size | 0~210mm*0~210mm(customized according to requirements) |
| Coating thickness | 50nm to 20um+ |
| Fragmentation rate | ≤0.05% |
| uptime | ≥98% |
| Anode life | ≥1 year |
| Current density | Gradient current density, adjustable from 0 to 30ASD |
| Potion circulation ability | 24cycle/h |
| Temperature accuracy control | ≤±1℃ |
CONTACT INFORMATION
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